01. Semiconductor & Physical Infrastructure
NVIDIA
TSMC
ASML
AMD
Intel
Qualcomm
Arm
Broadcom
Samsung
Synopsys
Cadence
Siemens EDA
Dell
Google Cloud
AWSSamsung FoundryIntel Foundry
LenovoThe physical hardware foundation and semiconductor supply chain powering modern AI, spanning silicon microarchitecture, EDA & verification, wafer fabrication & equipment, advanced packaging & HBM, and server systems engineering.
1.1 Compute Silicon Architecture & Custom Accelerators
GPU, CPU, TPU, NPU, custom ASIC, SoC, chiplet architecture, tensor/matrix engines, cache hierarchies, NoC interconnects, and heterogeneous compute.
GPU Microarchitecture & Parallel Compute Cores
Streaming multiprocessors (NVIDIA SM / AMD CU / Intel Xe Core), matrix engines (Tensor Core / Matrix Core), FP8/FP4/INT4 micro-op execution, warp/wavefront schedulers, and high-bandwidth on-chip SRAM.
NVIDIAAMDIntelArmQualcommDomain-Specific AI Accelerators & Custom ASIC
Google TPU (Systolic Arrays), AWS Trainium/Inferentia, Groq TSP (deterministic streaming), Cerebras Wafer-Scale Engine, and custom low-power edge/cloud ASIC accelerators.
Google CloudAWSBroadcomQualcommArm1.2 Silicon IP, EDA & Design Verification
EDA toolchains, Silicon IP cores (CPU/SerDes/NoC/D2D), logic synthesis, DFT/ATPG, formal verification, STA signoff, physical design, and multiphysics simulation.
EDA Automation, Physical Design & Signoff
Logic synthesis, automated place & route (P&R), static timing analysis (STA), IR drop & electromigration analysis, DRC/LVS physical signoff, and PDK enablement.
SynopsysCadenceSiemens EDASilicon IP, Frontend Verification & Multiphysics
High-speed SerDes/D2D interface IP, ARM/RISC-V CPU IP, UVM testbenches, formal property verification (SVA), DFT/ATPG scan insertion, and SI/PI electromagnetic/thermal multiphysics co-simulation.
ArmSynopsysCadenceSiemens EDA1.3 Semiconductor Equipment, Fabrication & Process Control
Foundry wafer manufacturing, EUV/DUV lithography, GAAFET/Nanosheet sub-3nm process integration, thin-film deposition, plasma etch, metrology, and wafer yield control.
Advanced Foundry & Process Integration
Sub-3nm/2nm advanced process nodes, Extreme Ultraviolet (EUV / High-NA EUV) lithography, Gate-All-Around (GAAFET/Nanosheet) transistors, Backside Power Delivery (BSPDN), and defect-driven wafer yield optimization.
TSMCSamsung FoundryIntel FoundrySemiconductor Equipment & Metrology Process Control
EUV lithography scanners, atomic layer deposition (ALD), high-density plasma etch, chemical-mechanical planarization (CMP), and optical/e-beam wafer defect inspection & CD-SEM metrology systems.
ASML1.4 Advanced Packaging, Chiplets & High-Speed Memory
CoWoS, SoIC, 2.5D/3D wafer-level packaging, Chiplet heterogeneous interconnects (UCIe), HBM3e/HBM4 high-bandwidth memory, DDR5 controllers, and high-density packaging yield.
Advanced Packaging & Chiplet Integration
Overcoming reticle limits: TSMC CoWoS / SoIC, Intel EMIB / Foveros, silicon interposers, through-silicon vias (TSV), micro-bumps & hybrid bonding, UCIe die-to-die standard, and advanced OSAT assembly.
TSMCIntelSamsungHBM & High-Speed Memory Subsystems
Conquering LLM training & inference memory walls: HBM3e/HBM4 3D DRAM die stacks, 1024-bit+ ultra-wide channels, MR-DIMM/CXL memory expansion, and high-performance memory controllers & PHYs.
Samsung1.5 AI Server Hardware, Power & Cooling
AI server architectures, GPU compute trays, OAM/UBB/MGX module standards, BMC/Redfish firmware, high-efficiency power delivery (PSU/PDU/Busbar), and direct-to-chip & immersion liquid cooling.
AI Server Systems & Hardware Architecture
8-GPU compute trays, rack-scale modular systems (OAM/UBB, MGX), PCIe Gen5/CXL high-speed baseboards, OpenBMC/Redfish management firmware, and hardware reliability testing.
DellLenovoHigh-Density Power Delivery & Liquid Cooling
100kW+ rack direct-to-chip microchannel cold plates, Coolant Distribution Units (CDU), secondary manifolds, 48V/HVDC busbars, titanium-grade PSU/PDU, and thermo-fluid CFD simulations.