1.3
1.3 Semiconductor Equipment, Fabrication & Process Control
Foundry wafer manufacturing, EUV/DUV lithography, GAAFET/Nanosheet sub-3nm process integration, thin-film deposition, plasma etch, metrology, and wafer yield control.
Advanced Foundry & Process Integration
Sub-3nm/2nm advanced process nodes, Extreme Ultraviolet (EUV / High-NA EUV) lithography, Gate-All-Around (GAAFET/Nanosheet) transistors, Backside Power Delivery (BSPDN), and defect-driven wafer yield optimization.
🏢 Companies
TSMC、Samsung Foundry、Intel Foundry
🛠️ Tech Stack
FoundryEUVGAAFETNanosheetBSPDNProcess IntegrationWafer YieldSPC/DOE
💼 Roles & Salary
Process Integration Engineer、Process Development Engineer、Yield Engineer
💰 $170K - $360K / year (Foundry PIE & Process) | ¥400K - ¥950K / year
📚 Prerequisites: Solid State & Semiconductor Device Physics • Advanced Semiconductor Fabrication • DOE & Statistical Process Control • Material Science & Failure Analysis
Semiconductor Equipment & Metrology Process Control
EUV lithography scanners, atomic layer deposition (ALD), high-density plasma etch, chemical-mechanical planarization (CMP), and optical/e-beam wafer defect inspection & CD-SEM metrology systems.
🏢 Companies
ASML、Applied Materials、Lam Research、Tokyo Electron、KLA、Onto Innovation
🛠️ Tech Stack
ASML EUVALDPlasma EtchCMPMetrologyDefect InspectionCD-SEMYield Management
💼 Roles & Salary
Equipment Engineer、Lithography/OPC Engineer、Metrology Engineer
💰 $175K - $370K / year (Equipment & Metrology) | ¥420K - ¥1.0M / year
📚 Prerequisites: Plasma Physics & Vacuum Systems • Optical Engineering & Precision Instrumentation • Thin Film Chemistry • Metrology Modeling & Algorithms