1.5
1.5 AI Server Hardware, Power & Cooling
AI server architectures, GPU compute trays, OAM/UBB/MGX module standards, BMC/Redfish firmware, high-efficiency power delivery (PSU/PDU/Busbar), and direct-to-chip & immersion liquid cooling.
AI Server Systems & Hardware Architecture
8-GPU compute trays, rack-scale modular systems (OAM/UBB, MGX), PCIe Gen5/CXL high-speed baseboards, OpenBMC/Redfish management firmware, and hardware reliability testing.
🏢 Companies
Supermicro、Dell、HPE、Lenovo、Quanta / QCT、Wiwynn、Foxconn
🛠️ Tech Stack
AI ServerCompute TrayOAM / UBBMGXPCIe Gen5 / CXLOpenBMCHardware Bring-up
💼 Roles & Salary
Server Hardware Engineer、Rack Systems Architect、Board/PCB Design Engineer、BMC/Firmware Engineer
💰 $170K - $360K / year (AI Server Systems) | ¥380K - ¥900K / year
📚 Prerequisites: Server Motherboard & High-speed PCB Design • PCIe / CXL / I2C / SPI Bus Specs • Embedded Linux BMC & Redfish Protocol • Hardware Bring-up & Validation
High-Density Power Delivery & Liquid Cooling
100kW+ rack direct-to-chip microchannel cold plates, Coolant Distribution Units (CDU), secondary manifolds, 48V/HVDC busbars, titanium-grade PSU/PDU, and thermo-fluid CFD simulations.
🏢 Companies
Vertiv、Schneider Electric、Eaton、Delta Electronics、CoolIT Systems、Supermicro
🛠️ Tech Stack
Direct-to-ChipCold PlateCDULiquid CoolingHVDC BusbarPDU / PSUCFD Thermal Simulation
💼 Roles & Salary
Power Electronics Engineer、Thermal Engineer、Liquid Cooling Engineer
💰 $165K - $350K / year (Power & Liquid Cooling) | ¥360K - ¥850K / year
📚 Prerequisites: Heat Transfer & CFD Simulations • Cold Plate & Liquid Cooling Loop Design • Power Electronics & High-efficiency PSU • Rack Mechanical & Liquid Sealing Specs